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ITEM | Capability | Details | Notes |
---|---|---|---|
Layer | 1~6 layer | 1-6 copper layers PCB (Don't support Blind/Buried Vias | |
Controlled Impedance PCB | 4 and 6 layer | Multilayer boards support impedance design | Controlled Impedance PCB Layer Stackup ZXHPCB Impedance Calculator |
Material | FR-4 | ALUMINIUM and FR-4 |
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Max size | 62cm*52cm | MAX SIZE IS 60*50CM | |
SOLDER MASK | LPI | Liquid Photo-Imageable Solder Mask is the most common mask type. |
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Finished Outer Layer Copper |
1oz~3oz (35um~105um) |
Max finished outer layer copper weight is 3oz |
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Finished Inner Layer Copper | 0.5oz(17um) | Finished inner layer copper weight is 0.5 oz only. |
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Dimension Tolerance(Outline) | ±0.15mm | Dimension Tolerance (Outline) is 0.15mm | |
Thickness | 0.4~3.0mm | 0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4/3.0 mm | |
Thickness Tolerance ( T≥1.0mm) | ± 10% | Eg. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6×10%) to 1.76mm(T+1.6×10%) | |
Thickness Tolerance ( T<1.0mm)(T<1.0mm) | ±0.1mm | 0.7mm(T-0.1)~0.9mm(T+0.1) | |
Drill Hole Size | 0.25~6.3mm | Min. drill size is 0.2mm, Max. drill size is 6.3mm. |
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Hole Size Tolerance | ±0.08mm | Eg. For the 0.6mm hole, the finished hole size between 0.52mm to 0.68mm is acceptable. | |
Min. Trace | 3.5mil | For Single&Double Layer PCB, the minimum trace width is 5 mil; For Multi Layer PCB, the minimum trace width is 3.5mil. |
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Min. Spacing | 4mil | For Single&Double Layer PCB, the minimum spacing is 5 mil; For Multi Layer PCB, the minimum spacing is 4mil. |
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Min. Via diameter | Min Inner Diameter (hole):0.25mm,Min Outer diameter :0.5mm | For multilayer pcb: Min Inner Diameter (hole):0.25mm,Min Outer diameter :0.5mm For double layer pcb: Min inner diameter:0.3MM, Min outer diameter :0.6MM |
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Pad to trace | 6mil | Minimum distance between and trace is 6mil |
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Annular Ring | 5mil | Annular Ring>5mil |
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Min. Character Width and Height | Min character width: 4mil Min Character height: 27.5mil | Characters width less than 4mil(0.153mm) will be unidentifiable. Characters height less than 32mil will be unidentifiable. |
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Trace to Outline(Ship as individual board with Rounting | ≥0.2mm | Ship as individual board(Rounting): Trace to Outline ≥0.2mm; Ship as panel with V-scoring: Trace to V-cut line ≥0.4mm |
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Trace to Outline(Ship as panel with V-scoring | ≥0.4mm | Ship as panel with V-scoring:Trace to V-cut line ≥0.4mm |
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Min Strip | 3mm | Ship as individual board(Rounting):Trace to Outline ≥0.2mm;Ship as panel with V-scoring:Trace to V-cut line ≥0.4mm |
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Panelization without space | 0mm | The distance between each pc is 0MM | |
Panelization with space | 1.6mm | Make sure the space between boards should be ≥1.6mm, otherwise it will be hard to process for rounting. | |
Min. Half Hole Diameter | 0.8mm | Half hole is a special technology, so half hole diameter should be bigger than 0.6mm. | |
Solder mask opening | 0.05mm | If need solder mask bridge, it should be more than 4MIL | |
NOTE 1:Copper Hatching with software Pads | Hatching | We will apply Copper Hatching if your PCBs designed with software Pads. Pls refer to the picture |
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NOTE2:Slots designed with software Pads | Outline | Please use Outline to design if there are many non-plated (NPTH) holes. |