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PCB process

  • Inner Layer
  • Double Layer
  • Inner Layer Pattern
  • Lamination
  • Drilling
  • Plated Through Hole
  • Dry Film
  • Pattern Plating & Etching
  • Solder-mask
  • Hot Air Leveing
  • Outline
  • Electric Testing
  • FQA&Packing
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  • Head office Add: Floor 17, Manjinghua Yingfeng Center,Bixin Road, Longgang district, Shenzhen China Copyright © 2006-2023 ZHXPCB 粤ICP备2020115165号